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Structure and Corosion behavior of highly Prefered oriented Copper film plated on Aluminum by Electroplating Process
Description:
Copper metal coatings onto others metal have been studied until recent years due to their significant potential applications and still many variety on the results. In this paper, a facile method was developed to prepare a copper coating onto aluminum substrates with different current density which affect on the structure, corrosion and morphology of the highly preferred oriented copper film. With the decrease of current density, the surface roughness decrease, thus resulting in more dense and lesser porosity. When the current density was less than 0.01 mA/cm2, the film become highly preferred oriented. The XRD pattern show only one peak around two theta 74.45o. Lowering the Current density, the film showed different corrossion resistance.
Author:
- Ferry Budhy Susetyo
- Bambang Soegijono
- Septian Rachmat Adnan
Source:
International Conference on Recent Innovation 2018[/vc_column_text][/vc_column][/vc_row]
